New Equipment & Capabilities
Pro-Active Engineering is beginning 2019 with a $265k capital investment in equipment designed to improve quality management, increase throughput with automation, and create new services for our customers.
Selective Conformal Coating
Conformal coating sprays help protect components on a printed circuit board from moisture, dirt, and extreme temperatures, however, it requires a labor-intensive masking process that slows production. The purchase of the Mycronic-MYC50 in-line coating system with multi-angle rotation precisely masks means accuracy and speed that only a machine can provide. The MYC50 represents the best aspects of mechanical automation, increasing output, accuracy, and safely handling caustic chemicals.
3D Solder Paste Inspector
With the increasing miniaturization and density of components on PCBA’s comes placement challenges these components are only as good as the micro-volumes of solder that connects them to the circuit board assembly. Pro-Active Engineering purchased the PI Primo M SPI uses multi-angle measurements to create a real-time 3D visualization of the volume of solder paste on the PCB significantly increasing the quality control process. This allows a technician to easily identify even the smallest solder defect before any components have been placed on a circuit board. The PI Primo M SPI with 3D technology is three times more precise than Pro-Active Engineering’s existing solder paste inspection system, improving production yields.
Improved Diagnostic with X-Ray
Micro BGA’s and leadless components have become increasingly popular in wearable electronics, and medical devices but present a unique challenge in that the solder connections cannot be visually inspected. This capital investment addresses that concern by adding the Jewel Box 90T to Pro-Active Engineering’s quality control system. The Jewel Box’s five axis manipulation and 5-micron x-ray source enable a technician to magnify components 2000 times, easily detecting solder bridges, solder voids, and missing solder.
|Download Equipment Sheet|
|DEK||Horizon 01i||1||Screen Print||Hawkeye Verification System|
|DEK||Horizon 8||1||Screen Print||Hawkeye Verification System|
|Mycronic||MY12E||1||Pick and Place||Dedicated Prototyping Machine|
|Mycronic||MY12E||1||Pick and Place||Low/Medium Production Line|
|Mycronic||MY200 SX14||1||Pick and Place||High Volume Conveyorized Line with LED Handling upgrade package|
|Mycronic||SMD Tower 6150-15||1||Component Storage
|An automated and intelligent storage system for reels and trays.|
|Vitronics||Soltec XPM3||2||Reflow Oven||Nine-zone Oven|
|Nordson||Yestech FX||2||Automated Optical Inspection- (AOI) System||Multi-spectrum
|Folungwin||FL-MD450||1||Wave Solder||Automated,Large PCB
Width of 450mm
|Vitronics||Soltec 6745||1||Selective Solder||Lead & Lead Free|
|SmartDRY||SD-10||1||Smart Component Drying System||SMARTBake technology intelligently controls MSL to the J-STD-033 specification while mitigating ESD at low humidity levels.|
|SmartDRY||SD-30||1||Smart Component Drying System||Intelligently control MSL to the J-STD-033 Specification while mitigating
ESD at low relative humidity levels.
|Aqueous Technologies||Trident ZDO||1||Board Wash Solution||Wash to 2000 Resistivity|
|Aqueous Technologies||Aqueous Zero Ion-24||1||Board Cleanliness Verification System||Military and IPC approved cleanliness tester. Meets- WS 6536, MIL STD 2000A, IPC J-STD 001, and TM650 2.3.24|
|Epilog||Mini 30 Watt||1||Laser Etcher||1200 DPI,CO² Cooled|
|Toppoint||2000 SMD Component Counter||2||SMT Component Counter||Double checks all
|Sonitek||TS500||1||Thermal Press||Heatstaking and Heat
Swaging Enclosure Solution
||MYC50||1||Selective Conformal Coating||Three Valve, Multi-Angle, High Volume|
|Mycronic||PI Primo M SPI||1||3D Solder Paste Inspector
||Real-time 3D Visualization of Solder Paste and Inspection
|Jewel Box||90T||1||X-Ray Inspection System
||5-Axis, 5 Micron X-Ray Source, 2000x Magnification|
|Creality||CR-10S & CR10S4
||Rapid-Prototyping, +/-0.1mm, PLA, ABS|